Wafer-level flip chip device packages and related methods

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United States of America Patent

PATENT NO 9496472
APP PUB NO 20160087180A1
SERIAL NO

14953840

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Abstract

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In accordance with certain embodiments, semiconductor dies are at least partially coated with a polymer and a conductive adhesive prior being bonded to a substrate having electrical traces thereon.

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Patent Owner(s)

  • COOLEDGE LIGHTING INC.

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Tischler, Michael A Vancouver, CA 178 5106

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