Microelectromechanical system device having a hinge layer
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United States of America Patent
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Nov 22, 2016
Grant Date -
Feb 4, 2016
app pub date -
Aug 1, 2014
filing date -
Aug 1, 2014
priority date (Note) -
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status (Latency Note)
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Abstract
A microelectromechanical system (MEMS) device includes a substrate and at least one MEMS unit disposed on the substrate. The MEMS unit includes at least one first electrode, at least one second electrode, at least one landing element, and a hinge layer. The first electrode is disposed on the substrate. The second electrode is disposed on the substrate. The landing element is disposed on the substrate. The hinge layer includes a hinge portion and at least one cantilever portion. The hinge portion is connected to the second electrode. The cantilever portion is connected to the hinge portion. The cantilever portion has a first opening and at least one spring disposed in the first opening and connected to at least one side of the first opening. When a voltage difference exists between the first electrode and the second electrode, the hinge portion is distorted and the spring thus touches the landing element.
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