Integration of pressure sensors into integrated circuit fabrication and packaging
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United States of America Patent
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Nov 22, 2016
Grant Date -
Jun 9, 2016
app pub date -
Feb 9, 2016
filing date -
Dec 27, 2013
priority date (Note) -
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status (Latency Note)
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Abstract
A pressure sensor is integrated into an integrated circuit fabrication and packaging flow. In one example, a releasable layer is formed over a removable core. A first dielectric layer is formed. A metal layer is patterned to form conductive metal paths and to form a diaphragm with the metal. A second dielectric layer is formed over the metal layer and the diaphragm. A second metal layer is formed to connect with formed vias and to form a metal mesh layer over the diaphragm. The first dielectric layer is etched under the diaphragm to form a cavity and the cavity is covered to form a chamber adjoining the diaphragm.
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