Thermal energy storage, dissipation and EMI suppression for integrated circuits using porous graphite sheets and phase change material
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United States of America Patent
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Nov 22, 2016
Grant Date -
Feb 12, 2015
app pub date -
Aug 10, 2013
filing date -
Aug 10, 2013
priority date (Note) -
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Abstract
Mobile platforms and methods may provide for an integrated circuit such as a system on chip (SoC), a first heat spreader thermally coupled to the integrated circuit and a phase change material configuration thermally coupled to the first heat spreader. The integrated circuit may include logic to operate the integrated circuit in a performance burst mode according to a duty cycle, wherein the performance burst mode causes a phase change material to enter a liquid state within a graphite matrix of the phase change material configuration.
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