Polish apparatus, polish method, and method of manufacturing semiconductor device

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 9502318
APP PUB NO 20150364389A1
SERIAL NO

14641734

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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A polish apparatus including a rotatable table configured to receive a polish pad having a polish surface; a polish head configured to hold a polish object and configured to be capable of placing the polish object in contact with the polish surface while holding the polish object; at least one contact portion being provided with a contact surface and configured to be capable of contacting the polish surface when the table is in rotation; and a measurement portion configured to measure a state of the contact surface of the contact portion being configured to contact the polish surface of the polish pad.

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Patent Owner(s)

  • TOSHIBA MEMORY CORPORATION

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Fukushima, Dai Kuwana, JP 43 296
Takayasu, Jun Yokkaichi, JP 21 115
Watanabe, Takashi Yokkaichi, JP 817 8763

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