PCB having offset differential signal routing
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United States of America Patent
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Jan 10, 2017
Grant Date -
Jul 31, 2014
app pub date -
Jan 27, 2014
filing date -
Jan 27, 2014
priority date (Note) -
Withdrawn
status (Latency Note)
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Abstract
In accordance with the various embodiments disclosed herein, an improved electrical connector footprints, such as printed circuit boards (printed circuit board), is described comprising one or more of, for example, a first linear array containing at least a first anti-pad extending along a first direction, a first electrical signal trace extending along the first direction and spaced from the first linear array along a second direction that is perpendicular to the first direction, a group of ground isolation vias containing at least one electrically conductive ground via arranged along a line extending parallel to the first direction and spaced from the first electrical signal trace along the second direction, and a second linear array containing at least a second anti-pad extending along the first direction spaced from the group of ground isolation vias along the second direction.
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