Package formed from pattern laminated double wall hot formable plastic webs with enhanced puncture resistance
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Nov 29, 2016
Grant Date -
Oct 2, 2014
app pub date -
Jun 11, 2014
filing date -
May 17, 2012
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
The present disclosure is concerned with packages formed from thermoformable webs with improved puncture resistance suitable for use in semi-automatic horizontal form fill and seal (HFFS) packaging machines and a process for packaging hard food items with sharp angular surfaces using such webs in such machines. The webs have a double wall partially laminated structure. The structure is conveniently formed by adhesively laminating two component films in a face to face configuration using a pattern of adhesive which leaves a substantial portion of the two facing surfaces unlaminated. The lamination just needs to be sufficient that the two component films will hot form together when they are vacuum drawn into a die to form a cavity for packaging the food items. The lamination pattern can vary from just edge strips to the edge strips and a honey comb pattern or a pattern of dots over the facing surfaces between the edge strips.
First Claim
Family
International Classification(s)
- [Classification Symbol]
- [Patents Count]
Cited Art Landscape
Patent Citation Ranking
Advertisement
Advertisement
Advertisement
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully