Methods of forming sensor integrated packages and structures formed thereby
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United States of America Patent
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Nov 29, 2016
Grant Date -
Sep 29, 2016
app pub date -
Mar 27, 2015
filing date -
Mar 27, 2015
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Abstract
Methods of forming sensor integrated package devices and structures formed thereby are described. An embodiment includes providing a substrate core, wherein a first conductive trace structure and a second conductive trace structure are disposed on the substrate core, forming a cavity between the first conductive trace structure and the second conductive trace structure, and placing a magnet on a resist material disposed on a portion of each of the first and second conductive trace structures, wherein the resist material does not extend over the cavity.
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