Polishing composition and method for producing substrate

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United States of America Patent

PATENT NO 9505950
APP PUB NO 20150210892A1
SERIAL NO

14423945

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Abstract

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A polishing composition includes a water-soluble polymer having a weight average molecular weight of 1000000 or less and a molecular weight distribution represented by weight average molecular weight (Mw)/number average molecular weight (Mn) that is less than 5.0. The polishing composition is mainly used in an application for polishing a substrate, preferably in an application for performing final polishing on a substrate.

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Patent Owner(s)

  • FUJIMI INCORPORATED

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Takahashi, Shuhei Kiyosu, JP 60 302
Tsuchiya, Kohsuke Kiyosu, JP 35 84

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