Solid body joining of a carrier body and a cover layer, particularly by anodic bonding

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United States of America Patent

PATENT NO 9507062
APP PUB NO 20150140276A1
SERIAL NO

14547318

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Abstract

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In a method for solid body joining of a carrier body (10) and a cover layer (20), in particular by anodic bonding, the cover layer (20) is pressed with a pressing force against a curved carrier body surface (11), wherein the pressing force during the solid body joining is distributed by way of a pressure intermediary device (30) areally and simultaneously over the whole cover layer (20) and is directed perpendicularly to the curvature of the carrier body surface (11). A composite component comprising a carrier body (10) and a cover layer (20) is also disclosed, wherein a curved areal joining region (13) is formed between a cover layer surface (21) and a carrier body surface (11).

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Patent Owner(s)

Patent OwnerAddress
ASML NETHERLANDS B VDE RUN 6501 VELDHOVEN NL-5504 DR

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Halalo, Khaldoun Zeuthen, DE 1 0
Pampuch, Carsten Berlin, DE 3 23
Schmidt, Volker Berlin, DE 105 1552

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