Wafer level overmold for three dimensional surfaces
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United States of America Patent
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Nov 29, 2016
Grant Date -
Feb 18, 2016
app pub date -
Aug 15, 2014
filing date -
Aug 15, 2014
priority date (Note) -
In Force
status (Latency Note)
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Abstract
Embodiments of the invention include a method for shaping a flexible integrated circuit to a curvature and the resulting structure. A flexible circuit is provided. An epoxy resin and amine composition is deposited on the flexible integrated circuit. The deposited epoxy resin and amine composition is B-staged. The flexible integrated circuit is placed within a mold of a curvature. The B-staged epoxy resin and amine composition is cured subsequent to placing the flexible integrated circuit within the mold of the curvature.
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Cited Art Landscape
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