Semiconductor device including leadframe with a combination of leads and lands and method
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United States of America Patent
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Nov 29, 2016
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N/A
app pub date -
Dec 30, 2015
filing date -
Jan 27, 2011
priority date (Note) -
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Abstract
In one embodiment, a semiconductor device includes a die pad defining multiple peripheral edge segments. In addition, the semiconductor device includes a plurality of leads and lands which are provided in a prescribed arrangement. Connected to the top surface of the die pad is at least one semiconductor die which is electrically connected to at least some of the leads and lands. At least portions of the die pad, the leads, the lands, and the semiconductor die are encapsulated by the package body, with at least portions of the bottom surfaces of the die pad and the lands being exposed in a common exterior surface of the package body.
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