Microelectronic die having chamfered corners
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United States of America Patent
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Nov 29, 2016
Grant Date -
Aug 11, 2016
app pub date -
Feb 10, 2015
filing date -
Feb 10, 2015
priority date (Note) -
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Abstract
A microelectronic die may be formed with chamfer corners for reducing stresses which can lead to delamination and/or cracking failures when such a microelectronic die is incorporated into a microelectronic package. In one embodiment, a microelectronic die may include at least one substantially planar chamfering side extending between at least two adjacent sides of a microelectronic die. In another embodiment, a microelectronic die may include at least one substantially curved or arcuate chamfering side extending between at least two adjacent sides of a microelectronic die.
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