Stacked dies with wire bonds and method

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 9508703
APP PUB NO 20150318264A1
SERIAL NO

14543760

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Abstract

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Semiconductor dies are bonded to each other and electrically connected to each other. An encapsulant is utilized to protect the semiconductor dies and external connections are formed to connect the semiconductor dies within the encapsulant. In an embodiment the external connections may comprise conductive pillars, conductive reflowable material, or combinations of such.

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Patent Owner(s)

Patent OwnerAddress
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY8 LI-HSIN RD 6 HSINCHU SCIENCE PARK HSINCHU 300-78

International Classification(s)

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Chen, Meng-Tse Changzhi Township, TW 100 1568
Chen, Ming-Fa Taichung, TW 524 4489
Cheng, Ming-Da Jhubei, TW 447 4774
Huang, Hui-Min Taoyuan, TW 110 1043
Lin, Hsiu-Jen Zhubei, TW 172 1408
Liu, Chung-Shi Hsin-Chu, TW 824 11367
Yeh, Sung-Feng Taipei, TW 199 1672
Yu, Chen-Hua Hsin-Chu, TW 2207 47923

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