Solid-state imaging apparatus and manufacturing method of solid-state imaging apparatus

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 9508775
APP PUB NO 20160056189A1
SERIAL NO

14933994

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Abstract

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The first face of the pad is situated between the front-side face of the second semiconductor substrate and a hypothetical plane including and being parallel to the front-side face, and a second face of the pad that is a face on the opposite side of the first face is situated between the first face and the front-side face of the second semiconductor substrate, and wherein the second face is connected to the wiring structure so that the pad is electrically connected to the circuit arranged in the front-side face of the second semiconductor substrate via the wiring structure.

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Patent Owner(s)

  • CANON KABUSHIKI KAISHA

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Kobayashi, Masahiro Tokyo, JP 425 3881
Shimotsusa, Mineo Machida, JP 101 833

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