Multi-layer printed circuit board and method for fabricating multi-layer printed circuit board

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United States of America Patent

PATENT NO 9510449
APP PUB NO 20140345932A1
SERIAL NO

14457433

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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Embodiments of the present disclosure relate to the field of electronics and, in particular, to a multi-layer printed circuit board and a method for fabricating the same. The circuit board is able to avoid the problem that signal transmission performance is affected by a plated hole. The multi-layer printed circuit board includes at least two layers of core plates that are adhered, where a circuit mechanical part is disposed on the core plates, a via is also provided on the core plates, and a metal column is embedded in the via, where one end of the metal column is connected to a corresponding position on an antenna feeder circuit mechanical part disposed on the core plate, and the other end is connected to a corresponding position on an antenna feeder circuit mechanical part disposed on an adjacent layer of the core plate. The method is used for fabricating a multi-layer printed circuit board.

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Patent Owner(s)

  • HUAWEI TECHNOLOGIES CO., LTD.

International Classification(s)

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Feng, Tao Shanghai, CN 159 915
Huang, Mingli Shenzhen, CN 8 27
Li, Songlin Shenzhen, CN 13 26

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