Thin film capping
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United States of America Patent
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Dec 6, 2016
Grant Date -
Nov 27, 2014
app pub date -
Dec 17, 2012
filing date -
Dec 15, 2011
priority date (Note) -
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status (Latency Note)
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Abstract
A method for sealing cavities in micro-electronic/-mechanical system (MEMS) devices to provide a controlled atmosphere within the sealed cavity includes providing a semiconductor substrate on which a template is provided on a localized area of the substrate. The template defines the interior shape of the cavity. Holes are made so as to enable venting of the cavity to provide a desired atmosphere to enter into the cavity through the hole. Finally, a sealing material is provided in the hole to seal the cavity. The sealing can be made by compression and/or melting of the sealing material.
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