Using wafer geometry to improve scanner correction effectiveness for overlay control

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United States of America Patent

PATENT NO 9513565
APP PUB NO 20150212429A1
SERIAL NO

14683880

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Abstract

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Systems and methods for providing improved scanner corrections are disclosed. Scanner corrections provided in accordance with the present disclosure may be referred to as wafer geometry aware scanner corrections. More specifically, wafer geometry and/or wafer shape signature information are utilized to improve scanner corrections. By removing the wafer geometry as one of the error sources that may affect the overlay accuracy, better scanner corrections can be obtained because one less contributing factor needs to be modeled.

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Patent Owner(s)

  • KLA-TENCOR CORPORATION

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Azordegan, Amir Santa Clara, US 15 94
MacNaughton, Craig Los Gatos, US 6 58
Sinha, Jaydeep Livermore, US 30 292
Veeraraghavan, Sathish Santa Clara, US 15 217
Vukkadala, Pradeep Fremont, US 23 167

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