Chip resistor and method for making the same
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United States of America Patent
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Dec 6, 2016
Grant Date -
Aug 28, 2014
app pub date -
Feb 25, 2014
filing date -
Feb 26, 2013
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
A chip resistor includes an insulating substrate, a resistor element arranged on the obverse surface of the substrate, a bonding layer provided between the resistor element and the substrate, a first electrode connected to the resistor element, and a second electrode connected to the resistor element. The second electrode is deviated from the first electrode in a direction perpendicular to the thickness direction of the substrate. The substrate includes a side surface between the obverse surface and the reverse surface. The first electrode covers the resistor element, and also the side surface and the reverse surface of the substrate.
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