Apparatus for testing package-on-package semiconductor device and method for testing the same
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United States of America Patent
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Dec 13, 2016
Grant Date -
Aug 13, 2015
app pub date -
Feb 9, 2015
filing date -
Feb 10, 2014
priority date (Note) -
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status (Latency Note)
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Abstract
An apparatus for testing a package-on-package semiconductor device comprises a pick and place device for loading a first chip into or unloading the first chip from a test socket and a lifting and rotating arm for moving a chip placement module which receives a second chip to a position between the pick and place device and the test socket. The pick and place device and the chip placement module are lowered, and then a test process is performed. After the test process is completed, the pick and place device and the chip placement module are lifted, and the lifting and rotating arm moves the chip placement module to one side of the pick and place device. Accordingly, a method for testing the semiconductor device could be performed automatically so as to greatly enhance test efficiency and accuracy and to significantly reduce costs.
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