Hybrid assembly with improved thermal performance
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United States of America Patent
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Dec 13, 2016
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app pub date -
Jan 13, 2016
filing date -
Aug 27, 2015
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Abstract
A method of improving the thermal performance of a hybrid assembly which comprises a first die, a second die, and indium bonds which bond and electrically interconnect the first die to the second die. A heat sink plate on which the hybrid assembly is to be mounted is provided. A plurality of indium bumps are deposited on the plate where the assembly is to be mounted. The bottom side of the hybrid assembly is then pressed onto the indium bumps to affix the assembly to the plate. The heat sink plate constrains the lateral coefficient of thermal expansion (CTE) of the second die such that the CTEs of the first and second dies match more closely than they would if the hybrid assembly was not mounted directly to a heat sink plate using indium bumps. The heat sink plate preferably comprises copper tungsten (CuW) or a diamond-metal composite.
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