Multilayer chip electronic component and board having the same
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United States of America Patent
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Dec 13, 2016
Grant Date -
Nov 12, 2015
app pub date -
Aug 11, 2014
filing date -
May 8, 2014
priority date (Note) -
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Abstract
A multilayer chip electronic component may include: a ceramic body including a plurality of dielectric layers; an inductor part disposed within the ceramic body; a capacitor part disposed within the ceramic body; a first dummy electrode disposed within the ceramic body and a second dummy electrode disposed within the ceramic body; and first to sixth external electrodes disposed on first and second main surfaces of the ceramic body, a first connection terminal disposed on the second main surface and first end surface of the ceramic body, and a second connection terminal disposed on the second main surface and second end surface of the ceramic body. The inductor part may include first and second inductor parts, and the inductor part and the capacitor part are connected to each other.
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