Apparatus for cutting transmission electron microscope micro-grids

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United States of America Patent

PATENT NO 9522823
APP PUB NO 20130256361A1
SERIAL NO

13729425

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Abstract

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An apparatus for cutting micro-grids from a metal substrate is provided. The apparatus includes a support and a cutting module. The support includes a supporting surface, the support is configured to support a micro-grid and the metal substrate. The cutting module includes a fixing element, a spring and a cutting structure. The fixing structure and the spring are located in the cutting structure. The fixing element is configured to fix the micro-grid on the supporting surface. The cutting structure is configured to cut the micro-grid from the metal substrate.

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Patent Owner(s)

Patent OwnerAddress
HON HAI PRECISION INDUSTRY CO LTD66 CHUNG SHAN ROAD TU-CHENG TAIPEI HSIEN
TSINGHUA UNIVERSITYNO 1 QINGHUA YUAN HAIDIAN DISTRICT BEIJING P R C

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Feng, Chen Beijing, CN 452 18070
Guo, Xue-Wei Beijing, CN 19 31

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