Vacuum film formation method and laminate obtained by the method

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United States of America Patent

PATENT NO 9523147
APP PUB NO 20120276396A1
SERIAL NO

13458640

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Abstract

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A method of continuously subjecting an elongated substrate to vacuum film formation is disclosed. The method comprises the steps of: feeding a first substrate from a first roll chamber in a first direction from the first roll chamber toward a second roll chamber; degassing the first substrate; forming a film of a second material on the first substrate, in a second film formation chamber; and rolling up the first substrate in the second roll chamber, thereby producing the first substrate, and comprises similar steps to produce a second substrate. In advance of producing the first substrate with the second material film, the first cathode electrode of the first film formation chamber is removed from the first film formation chamber, and, in advance of producing the second substrate with the first material film, the second cathode electrode of the second film formation chamber is removed from the second film formation chamber.

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Patent Owner(s)

  • NITTO DENKO CORPORATION

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Hamada, Akira Osaka, JP 105 1080
Ishibashi, Kuniaki Osaka, JP 35 239
Ito, Yoshihisa Osaka, JP 67 345
Nashiki, Tomotake Osaka, JP 90 671
Sakata, Yoshimasa Osaka, JP 30 289
Sugawara, Hideo Osaka, JP 71 945
Yagura, Kenkichi Osaka, JP 8 47

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