Grinding wheel for wafer edge trimming

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United States of America Patent

PATENT NO 9527188
APP PUB NO 20140051336A1
SERIAL NO

13629889

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Abstract

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A grinding wheel for wafer edge trimming includes a head having an open side and an abrasive end bonded around an edge of the open side of the head. The abrasive end is arranged to have multiple simultaneous contacts around a wafer edge during the wafer edge trimming.

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Patent Owner(s)

Patent OwnerAddress
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTDNO 8 LI-HSIN RD 6 SCIENCE-BASED INDUSTRIAL PARK HSIN-CHU 300-77 R O C

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Chao, Lan-Lin Sindian, TW 87 2310
Hsieh, Yuan-Chih Hsinchu, TW 102 1115
Huang, Xin-Hua Xihu Township, TW 73 1348
Liu, Ping-Yin Yonghe, TW 108 2161
Tsai, Chia-Shiung Hsinchu, TW 515 6971

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