Pressure-sensitive adhesive layer for transparent conductive film, transparent conductive film with pressure-sensitive adhesive layer, transparent conductive laminate, and touch panel

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United States of America Patent

PATENT NO 9527944
APP PUB NO 20130141879A1
SERIAL NO

13693935

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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Provided is a pressure-sensitive adhesive layer for a transparent conductive film having a patterned transparent conductive thin film, which has transparent as the pressure-sensitive adhesive layer for transparent conductive film and can prevent the patterned transparent conductive thin film from degrading the appearance of the conductive film. A pressure-sensitive adhesive layer for a transparent conductive film having a patterned transparent conductive thin film, wherein the pressure-sensitive adhesive layer is made from an acrylic pressure-sensitive adhesive composition containing: 100 parts by weight of an acryl-based polymer obtained by polymerization of a monomer component including an alkyl(meth)acrylate; and 30 to 150 parts by weight of a styrene-based oligomer, the pressure-sensitive adhesive layer has a refractive index of 1.50 or more, the pressure-sensitive adhesive layer has a haze of 2% or less as measured at a thickness of 30 μm.

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Patent Owner(s)

  • NITTO DENKO CORPORATION

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Higashi, Masatsugu Osaka, JP 17 53
Kamiya, Katsuhiko Osaka, JP 32 222
Matsuura, Aimi Osaka, JP 12 55
Tanaka, Akiko Osaka, JP 93 552
Yamasaki, Mizue Osaka, JP 10 30

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