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Abstract

The present invention provides a method of improving lifetime of etching liquid and yield in Cu-interconnection process and a Cu-interconnection etching device. The method comprises: step 1, providing an etching spray rising tank (1) and an etching liquid tank (2) connected to the etching spray rising tank (1), and the etching liquid tank (2) contains etching liquid; step 2, employing a first concentration monitoring device (4) to measure a copper ion concentration of the etching liquid in the etching liquid tank (2), and employing a filter (5) to perform copper ion filtering to the etching liquid in the etching liquid tank (2); step 3, employing a second concentration monitoring device (6) to measure a copper ion concentration of the etching liquid after filtering in the step 2, and controlling an amount of the filters (5) employed in the step 2 and reflowing the etching liquid after filtering to the etching liquid tank (2). The present invention can reduce the copper ion concentration of the etching liquid to promote the usage lifetime of the etching liquid and reduce the production cost for raising the stability and yield of the Cu-interconnection production.

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First Claim