Packaged microelectronic devices and methods for manufacturing packaged microelectronic devices
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United States of America Patent
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Dec 27, 2016
Issued Date -
N/A
app pub date -
Jan 23, 2015
filing date -
Jun 10, 2008
priority date (Note) -
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Abstract
Packaged microelectronic devices and methods for manufacturing packaged microelectronic devices are disclosed herein. In one embodiment, a packaged microelectronic device can include a support member, a first die attached to the support member, and a second die attached to the first die in a stacked configuration. The device can also include an attachment feature between the first and second dies. The attachment feature can be composed of a dielectric adhesive material. The attachment feature includes (a) a single, unitary structure covering at least approximately all of the back side of the second die, and (b) a plurality of interconnect structures electrically coupled to internal active features of both the first die and the second die.
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