Method of clamping a semiconductor assembly

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United States of America Patent

PATENT NO 9530750
APP PUB NO 20120192392A1
SERIAL NO

13416429

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Abstract

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The present invention relates to a method of clamping a semiconductor assembly with a desired compression force equally distributed across the opposing surfaces of the devices and associated components of the semiconductor assembly.

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Patent Owner(s)

Patent OwnerAddress
INDUCTOTHERM CORP10 INDEL AVENUE PO BOX 157 RANCOCAS NJ 08073

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Fishman, Oleg S Maple Glen, US 79 834
Prabhu, Satyen N Voorhees, US 25 87

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