Microelectronic assemblies with integrated circuits and interposers with cavities, and methods of manufacture
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Jan 3, 2017
Grant Date -
May 12, 2016
app pub date -
Dec 28, 2015
filing date -
Jul 10, 2014
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
Semiconductor integrated circuits (110) or assemblies are disposed at least partially in cavities between two interposers (120). Conductive vias (204M) pass through at least one of the interposers or at least through the interposer's substrate, and reach a semiconductor integrated circuit or an assembly. Other conductive vias (204M.1) pass at least partially through multiple interposers and are connected to conductive vias that reach, or are capacitively coupled to, a semiconductor IC or an assembly. Other features are also provided.
First Claim
Family
International Classification(s)
Cited Art Landscape
Patent Citation Ranking
Advertisement
Advertisement
Advertisement
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully