Wired circuit board and producing method thereof

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 9538639
APP PUB NO 20150245472A1
SERIAL NO

14619508

Stats

ATTORNEY / AGENT: (SPONSORED)

Importance

Loading Importance Indicators... loading....

Abstract

See full text

A wired circuit board includes a first insulating layer, a first conductive layer provided over the first insulating film and including a first wire, a second insulating layer provided over the first insulating layer so as to cover the first wire, and a second conductive layer provided over the second insulating layer and including a second wire. The second conductive layer includes a first terminal portion for electrically connecting the first wire to an outside, a second terminal portion for electrically connecting the second wire to an outside, and a connection portion electrically connecting the first terminal portion and the first wire.

Loading the Abstract Image... loading....

First Claim

See full text

Family

Loading Family data... loading....

Patent Owner(s)

  • NITTO DENKO CORPORATION

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Tanabe, Hiroyuki Osaka, JP 83 468

Cited Art Landscape

Load Citation

Patent Citation Ranking

Forward Cite Landscape

Load Citation

Maintenance Fees

Fee Large entity fee small entity fee micro entity fee due date
7.5 Year Payment $3600.00 $1800.00 $900.00 Jul 3, 2024
11.5 Year Payment $7400.00 $3700.00 $1850.00 Jul 3, 2028
Fee Large entity fee small entity fee micro entity fee
Surcharge - 7.5 year - Late payment within 6 months $160.00 $80.00 $40.00
Surcharge - 11.5 year - Late payment within 6 months $160.00 $80.00 $40.00
Surcharge after expiration - Late payment is unavoidable $700.00 $350.00 $175.00
Surcharge after expiration - Late payment is unintentional $1,640.00 $820.00 $410.00