Process for electroless copper deposition on laser-direct structured substrates

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United States of America Patent

PATENT NO 9538665
APP PUB NO 20140255600A1
SERIAL NO

14350971

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Abstract

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The invention disclosed relates to an aqueous activator solution and a method for the electroless deposition of copper on a laser direct structured substrate surface. By the invention, an aqueous activator solution comprising a strong reducing agent is proposed to enhance the catalytic activity of the irradiated surface area of a LDS substrate.

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CITIBANK N A388 GREENWICH STREET NEW YORK NY 10013

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Bastenbeck, Edwin W Watertown, US 4 101
Orschel, Harald Langenfeld, DE 1 9
Prinz, Ulrich Solingen, DE 7 46

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