Bonding structure of electronic equipment

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 9538666
APP PUB NO 20150043175A1
SERIAL NO

14218803

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Abstract

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Provided is a bonding structure of an electronic equipment including first electrodes extended in a first direction and arranged in a second direction on a stretchable display panel having stretchability, second electrodes extended in a first direction and arranged in a second direction on a substrate and facing the first electrodes, and solder bonding parts interposed between the first electrodes and the second electrodes, facing each other in the second direction, and constituting a plurality of rows in the first direction.

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Patent Owner(s)

  • ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Bae, Hyun-cheol Daejeon, KR 27 118
Choi, Kwang-Seong Daejeon, KR 51 327
Eom, Yong Sung Daejeon, KR 48 160
Lee, Haksun Daejeon, KR 8 45

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