Wafer cleaning device and method thereof

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 9539621
APP PUB NO 20140096800A1
SERIAL NO

14108376

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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A wafer cleaning device comprising a wafer stage for holding a wafer having a surface to be washed, a first nozzle positioned above the wafer, a second nozzle positioned above the wafer. A first height is between the first nozzle and the surface and a second height is between the second nozzle and the surface, wherein the first height is shorter than the second height.

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Patent Owner(s)

  • UNITED MICROELECTRONICS CORP.

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Chuang, Wei-Hong Taoyuan County, TW 10 31
Lee, Ming-Hsin Taoyuan County, TW 10 49
Liu, Chin-Kuang Hsinchu, TW 6 14
Lu, Yan-Yi Taoyuan County, TW 2 6
Tsai, Hsin-Ting Hsinchu, TW 9 34
Tung, Kuei-Chang Miaoli County, TW 2 6
Wang, Chin-Chin Yun-Lin County, TW 2 6
Yu, Cheng-Hung Taoyuan County, TW 49 411

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