Heat-curable polyorganosiloxane composition and use thereof
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United States of America Patent
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Jan 10, 2017
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Mar 21, 2013
app pub date -
Dec 6, 2011
filing date -
Dec 22, 2010
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Abstract
A heat-curable polyorganosiloxane composition which includes (A) an alkenyl group-containing linear polyorganosiloxane of the formula (I) below, wherein Ra represents a C2-C6 alkenyl and Rb represents a C1-C6 alkyl or a phenyl; (B1) a linear polyorganohydrogensiloxane of the formula (II) below, wherein Rc is hydrogen and Rd represents a C1-C6 alkyl or a phenyl; (B2) a cyclic polyorganohydrogensiloxane including Re2HSiO1/2, wherein Re represents a hydrogen atom or C1-C6 alkyl group, and SiO4/2, and having three or more hydrogen atoms bonded to a silicon atom in one molecule; (C) a platinum series catalyst; and (D) an adhesion promoter, wherein the formula (I) and the formula (II) are as follows:
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