Heated electrostatic chuck and semiconductor wafer heater and methods for manufacturing same
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United States of America Patent
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Jan 10, 2017
Grant Date -
Oct 2, 2014
app pub date -
Sep 26, 2013
filing date -
Apr 1, 2013
priority date (Note) -
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Abstract
A heated electrostatic chuck is provided, including a base having an upper surface and peripheral side surfaces, a thermal barrier coating formed by plasma deposition directly on at least the upper surface of the base, at least one heating element formed on portions of the thermal barrier coating, an electrically insulating layer formed on the heating element and exposed portions of the thermal barrier coating, at least one chucking electrode formed on at least a portion of the electrically insulating layer, and a protective layer formed on the chucking electrode.
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