Semiconductor device and method of manufacturing the same

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United States of America Patent

PATENT NO 9543194
APP PUB NO 20160163581A1
SERIAL NO

14641718

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Abstract

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In one embodiment, a semiconductor device includes a first insulator, and conductors and second insulators alternately provided on the first insulator. Each second insulator of the second insulators has a first side face adjacent to one of the conductors via a first air gap, a second side face adjacent to one of the conductors via a second air gap, first lower faces in contact with the first insulator, and second lower faces provided above the first insulator via third air gaps.

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Patent Owner(s)

  • TOSHIBA MEMORY CORPORATION

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Yoshida, Kiyomitsu Kuwana, JP 14 67

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