Multilayer ceramic electronic component and board having the same mounted thereon
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United States of America Patent
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Jan 10, 2017
Grant Date -
May 14, 2015
app pub date -
Apr 8, 2014
filing date -
Nov 14, 2013
priority date (Note) -
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Abstract
A multilayer ceramic electronic component may include: a multilayer ceramic capacitor including a ceramic body in which a plurality of dielectric layers are stacked, a pair of first external electrodes and a pair of second external electrodes formed on both side surfaces of the ceramic body and extended to portions of a mounting surface of the ceramic body, and first and second internal electrodes alternately stacked, having the dielectric layer therebetween, exposed through at least one side surface of the ceramic body, and connected to the first and second external electrodes, respectively; and an interposer substrate including an insulation substrate bonded to the mounting surface of the multilayer ceramic capacitor, and first and second connection terminals formed on the insulation substrate and connected to the first and second external electrodes, respectively.
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