Structures for z-axis interconnection of multilayer electronic substrates

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United States of America Patent

PATENT NO 9545017
APP PUB NO 20140231126A1
SERIAL NO

14183488

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Abstract

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Invention z-axis interconnection structures provide a means to mechanically and electrically interconnect layers of metallization in electronic substrates reliably and in any configuration. Invention z-axis interconnection structures comprise a novel bonding film and conductive paste and one- and two-piece building block structures formed therefrom.

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Patent Owner(s)

Patent OwnerAddress
INTEGRAL TECHNOLOGY INC20322 WINDROW DRIVE LAKE FOREST CA 92630

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Friesen, G Delbert Santa Rosa, US 4 136
Holcomb, Kenneth C San Diego, US 4 121
Hunrath, Christopher A San Juan Capistrano, US 6 58
Shearer, Catherine A San Marcos, US 7 32
Tran, Khang Duy Anaheim, US 1 25

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