Monolithic integrated circuit die having modular die regions stitched together

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United States of America Patent

PATENT NO 9547034
APP PUB NO 20150008954A1
SERIAL NO

13935066

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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An apparatus for a monolithic integrated circuit die is disclosed. In this apparatus, the monolithic integrated circuit die has a plurality of modular die regions. The modular die regions respectively have a plurality of power distribution networks for independently powering each of the modular die regions. Each adjacent pair of the modular die regions is stitched together with a respective plurality of metal lines.

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Patent Owner(s)

  • XILINX, INC.

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Camarota, Rafael C San Jose, US 51 1566

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