Microelectronic assembly with multi-layer support structure

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United States of America Patent

PATENT NO 9548145
APP PUB NO 20140224419A1
SERIAL NO

14096906

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Abstract

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A method of forming a microelectronic assembly includes positioning a support structure adjacent to an active region of a device but not extending onto the active region. The support structure has planar sections. Each planar section has a substantially uniform composition. The composition of at least one of the planar sections differs from the composition of at least one of the other planar sections. A lid is positioned in contact with the support structure and extends over the active region. The support structure is bonded to the device and to the lid.

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Patent Owner(s)

  • INVENSAS CORPORATION

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Humpston, Giles Buckinghamshire, GB 82 3921
Nystrom, Michael J San Jose, US 41 1509

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