Semiconductor package

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 9548271
SERIAL NO

14932122

Stats

ATTORNEY / AGENT: (SPONSORED)

Importance

Loading Importance Indicators... loading....

Abstract

See full text

A semiconductor package includes a substrate, a first passivation layer disposed on the substrate, and an under bump metallurgy layer disposed on the first passivation layer. An additional under bump metallurgy layer is disposed on the first passivation layer, isolated from the under bump metallurgy layer; and a conductive pillar disposed on the additional under bump metallurgy layer.

Loading the Abstract Image... loading....

First Claim

See full text

Family

Loading Family data... loading....

Patent Owner(s)

  • MEDIATEK INC.

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Chan, Kuei-Ti Hsinchu, TW 15 58
Huang, Ching-Liou Qionglin Township, Hsinchu County, TW 14 76
Lin, Tzu-Hung Zhubei, TW 111 841

Cited Art Landscape

Load Citation

Patent Citation Ranking

Forward Cite Landscape

Load Citation

Maintenance Fees

Fee Large entity fee small entity fee micro entity fee due date
7.5 Year Payment $3600.00 $1800.00 $900.00 Jul 17, 2024
11.5 Year Payment $7400.00 $3700.00 $1850.00 Jul 17, 2028
Fee Large entity fee small entity fee micro entity fee
Surcharge - 7.5 year - Late payment within 6 months $160.00 $80.00 $40.00
Surcharge - 11.5 year - Late payment within 6 months $160.00 $80.00 $40.00
Surcharge after expiration - Late payment is unavoidable $700.00 $350.00 $175.00
Surcharge after expiration - Late payment is unintentional $1,640.00 $820.00 $410.00