Electroless plating solution with at least two borane containing reducing agents

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United States of America Patent

PATENT NO 9551074
SERIAL NO

14297352

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Abstract

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A solution for providing electroless deposition of a metal layer on a substrate is provided. A solvent is provided. A metal precursor is provided to the solvent. A first borane containing reducing agent is provided to the solvent. A second borane containing reducing agent is provided to the solvent, wherein the first borane containing reducing agent has a deposition rate of at least five times a deposition rate of the second borane containing reducing agent, and wherein the solution is free of nonborane reducing agents.

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Patent Owner(s)

  • LAM RESEARCH CORPORATION

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Bin, Xiaomin San Jose, US 5 8
Kolics, Artur Dublin, US 74 1323
Li, Nanhai Pleasanton, US 12 124
Little, Patrick Brentwood, US 5 18
Nalla, Praveen Fremont, US 15 82
Polyanskaya, Marina Morgan Hill, US 4 33
Wang, Yaxin Fremont, US 45 2957

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