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• 15 United States
• 10 France
• 8 Japan
• 7 China
• 5 Korea
• 2 Other

Patent Owner(s)

Patent Owner	Address
SUZHOU SHINHAO MATERIALS LLC	2358 CHANGAN ROAD BUILDING #9 FIRST FLOOR WUJIANG 215200

International Classification(s)

• C25D:PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC ....
• C07D:HETEROCYCLIC COMPOUNDS

• [Classification Symbol]

• [Patents Count]

Inventor(s)

Inventor Name	Address	# of filed Patents	Total Citations
Dong, Peipei	Wujiang, CN	10	7
Ma, Tao	Wujiang, CN	221	973
Zhang, Yun	Warren, US	273	1506

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Maintenance Fees

Fee	Large entity fee	small entity fee	micro entity fee	due date
11.5 Year Payment	$7400.00	$3700.00	$1850.00	Jul 24, 2028

Fee	Large entity fee	small entity fee	micro entity fee
Surcharge - 11.5 year - Late payment within 6 months	$160.00	$80.00	$40.00
Surcharge after expiration - Late payment is unavoidable	$700.00	$350.00	$175.00
Surcharge after expiration - Late payment is unintentional	$1,640.00	$820.00	$410.00

DATE PUBLISHED	PUBLICATION/PATENT NO.	PUBLICATION TYPE
January 24, 2017	US,9551081,B2   US9551081B2	GRANTED PATENT AS SECOND PUBLICATION
December 24, 2015	US,20150368819,A1   US20150368819A1	FIRST PUBLISHED PATENT APPLICATION

Full Text

US Patent No: 9551081

Leveling composition and method for electrodeposition of metals in microelectronics

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