Applying pressure to adhesive using CTE mismatch between components
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United States of America Patent
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Jan 31, 2017
Grant Date -
N/A
app pub date -
Dec 9, 2015
filing date -
Dec 9, 2015
priority date (Note) -
In Force
status (Latency Note)
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Abstract
Assembly apparatuses and processes are provided which include a pressure cure fixture. The pressure cure fixture is sized to reside within a container, such as an electronic enclosure, and facilitate applying pressure to an adhesive disposed over an inner surface of the container. The pressure cure fixture is formed of a material with a higher coefficient of thermal expansion (CTE) than the container, and is sized to correspond, at least in part, to an inner space of the container while allowing for the adhesive and a surface-mount element to be disposed between the pressure cure fixture and the inner surface of the container. When heated, the pressure cure fixture expands greater than the container and imparts the pressure to the surface-mount element and the adhesive to facilitate securing the surface-mount element to the inner surface of the container.
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