Magnesium-based composite member, heat radiation member, and semiconductor device
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United States of America Patent
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Jan 31, 2017
Grant Date -
Jan 10, 2013
app pub date -
Mar 16, 2011
filing date -
Apr 2, 2010
priority date (Note) -
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status (Latency Note)
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Abstract
A magnesium-based composite member is provided with a through hole through which a fastening member for attachment to a fixing target is to be inserted. A substrate is provided with a substrate hole through which the fastening member is to be inserted, and made of a composite material which is a composite of SiC and a matrix metal which is any of magnesium and a magnesium alloy. A receiving portion is attached to the substrate and made of a metal material different from the matrix metal. The receiving portion is provided with a receiving portion hole through which the fastening member is to be inserted, and at least a part of an inner circumferential surface of the through hole is formed from an inner circumferential surface of the receiving portion hole.
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