Method for manufacturing electro-optical device, electro-optical device, and electronic apparatus

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United States of America Patent

PATENT NO 9557561
SERIAL NO

15018086

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Importance

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Abstract

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After a first wafer on which mirrors and terminals are formed and a second wafer for sealing are stacked and bonded together, the first wafer and the second wafer are diced to manufacture electro-optical devices. In doing so, in a second surface of the second wafer, recesses overlapping the mirrors in a plan view are previously formed, and also grooves overlapping the terminals in the plan view are previously formed. For this reason, when the second wafer is diced along the grooves by advancing a dicing blade for second wafer from a third surface of the second wafer, the dicing blade for second wafer can be prevented from coming into contact with the terminal.

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Patent Owner(s)

  • SEIKO EPSON CORPORATION

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Kondo, Manabu Matsumoto, JP 45 252

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