Method of patterning block copolymer layer and patterned structure

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United States of America Patent

PATENT NO 9557639
SERIAL NO

14078921

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Abstract

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A method of patterning a block copolymer layer, the method including: providing a substrate with a guide pattern formed on a surface thereof; forming a block copolymer layer on the substrate with the guide pattern, the block copolymer layer including a block copolymer; and directing self-assembly of the block copolymer on the substrate according to the guide pattern to form n/2 discrete domains, wherein the guide pattern includes a block copolymer patterning area having a 90-degree bending portion, and an outer apex and an inner apex of the 90-degree bending portion are each rounded, the outer apex having a first curvature radius r1, and the inner apex having a second curvature radius r2, respectively, and the width of the patterning area W, the first curvature radius r1 and the second curvature radius r2, satisfy Inequation 1:

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Patent Owner(s)

Patent OwnerAddress
SAMSUNG ELECTRONICS CO LTD129 SAMSUNG-RO YEONGTONG-GU SUWON-SI GYEONGGI-DO 16677
YONSEI UNIVERSITY UNIVERSITY - INDUSTRY FOUNDATION(UIF)134 SHINCHON-DONG SEODAEMOON-GU SEOUL 120-749

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Han, In Taek Seoul, KR 22 115
Huh, June Seoul, KR 5 8
Jeong, Seong-Jun Ulsan-si, KR 6 34
Kim, Mi-Jeong Hwaseong-si, KR 23 240
Koh, Haeng Deog Hwaseong-si, KR 10 159
Park, Youn Jung Seoul, KR 3 10

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