Base film and pressure-sensitive adhesive sheet provided therewith

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United States of America Patent

PATENT NO 9559073
APP PUB NO 20140079947A1
SERIAL NO

14005574

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Importance

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Abstract

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To prevent bumps on the circuit side of a bump-bearing wafer from getting crushed when grinding the back side of said wafer while protecting the circuit side with a surface-protection sheet, and also to minimize the formation of dimples and cracks on the side being ground.

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Patent Owner(s)

Patent OwnerAddress
LINTEC CORPORATIONTOKYO 173-0001
ARAKAWA CHEMICAL INDUSTRIES LTDOSAKA JAPAN OSAKA-SHI OSAKA

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Akutsu, Takashi Tokyo, JP 77 1252
Eto, Yuki Tokyo, JP 4 32
Hukuzaki, Tomohide Osaka, JP 2 28
Tamura, Kazuyuki Tokyo, JP 15 124

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