Multi-chip package having a substrate with a plurality of vertically embedded die and a process of forming the same

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 9559088
APP PUB NO 20140248742A1
SERIAL NO

14279165

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Abstract

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An apparatus includes a substrate having a land side having a plurality of contact pads and a die side opposite the land side. The apparatus includes a first die and a second die wherein the first die and second die are embedded within the substrate such that the second die is located between the first die and the land side of the substrate.

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Patent Owner(s)

  • INTEL CORPORATION

International Classification(s)

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Gonzalez, Javier Soto Chandler, US 15 434
Jomaa, Houssam Phoenix, US 32 261

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